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And humidity module, http://akizukidenshi.com/download/ds/aosong/DHT11.pdf Temperature and humidity module, http://akizukidenshi.com/download/ds/aosong/DHT11.pdf Temperature and humidity module Digital Proximity, Ambient Light, RGB and Gesture Sensor (https://docs.broadcom.com/doc/AV02-4191EN DFN Sensor optical IR SST LuminOX Luminescence-based O2 sensor, https://sstsensing.com/wp-content/uploads/2021/08/DS0030rev15_LuminOx.pdf Gas Sensor, 6 pin, 4.0x2.6, 0.65P; Two exposed pads, (https://www.onsemi.com/pub/Collateral/511BZ.PDF DFN 0.65P dual flag WDFN-8 1EP 2.2X2.0 0.5P WDFN, 8 Pin (http://ww1.microchip.com/downloads/en/devicedoc/20005514a.pdf#page=35), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-150-02-xxx-DV-A, 50 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039300020_sd.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-14DS-0.5V, 14 Pins per row, Mounting: PCB Mounting Flange (http://www.molex.com/pdm_docs/sd/039291047_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System, 5267-02A, 2 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 24 Pin (JEDEC MO-194 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (6mm x 5mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic Small Outline Package (MS) [MSOP], variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 10x-dip-switch SPST Copal_CHS-10B, Slide, row spacing 10.16 mm (400 mils 14-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing.

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