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3.3x3.3x1 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/AD7682_7689.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF63M-3P-3.96DSA, 3 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP, 20 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 4 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/drv8801.pdf#page=31 MO-220 variation VJJD-2), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-114-02-xxx-DV-A, 14 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1210, with PCB locator, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf.

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