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2.54mm staggered type-1 TO-220-5, Vertical, RM 2.54mm, staggered type-1 TO-220-7 Vertical RM 10.9mm TO-264-3, Horizontal, RM 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Horizontal RM 2.54mm staggered type-1 TO-220F-15 Vertical RM 2.29mm IPAK TO-251-3, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Vertical RM 2.54mm TO-220F-4, Horizontal, RM 2.54mm, staggered type-1 TO-220F-4, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-4 Vertical RM 5.475mm SOT-93 TO-218-3, Vertical, RM 1.27mm, staggered type-2 TO-220-9, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 26.669999999999998mm 1050mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x14.26mm (see e.g. Http://www.ti.com/lit/ds/symlink/drv5023.pdf TO-92L leads in-line (large body variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 3x-dip-switch SPST , Slide, row spacing 5.25 mm (206 mils), body size 10.8x24.42mm 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 3x-dip-switch SPST , Piano, row spacing 25.4 mm (1000 mils), LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments BGA-289, 0.4mm pad, based on the mid surdos.

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