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Temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole Total plated holes Total unplated holes count 16 ============================================================= Total unplated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes count.

• FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.65mm.
• DFN Sensor optical IR SST.

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