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ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485.

• Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC.
• 09HCP, http://cdn-reichelt.de/documents/datenblatt/B400/DS_09HCP.pdf Inductor Radial series Radial pin pitch.
• UQFN DFN 0.5 ST 20-Lead Plastic Quad Flat.

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