Labels Milestones
Back0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole pin header THT 1x37 1.27mm single row style1 pin1 left Surface mounted socket strip SMD 1x20 2.54mm single row Through hole angled socket strip THT 2x27 2.00mm double row Through hole straight socket strip, 2x09, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole straight pin header, 1x35, 2.00mm pitch, 6.35mm socket length, double rows Through hole socket strip THT 2x17 2.00mm double row surface-mounted straight socket strip, 1x40, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x08, 1.27mm pitch, single row Through hole angled socket.
- Diamater 1.3mm, pad diameter 2.7mm, size source.
- Jack, Vertical (https://www.we-online.com/components/products/datasheet/66012102111404.pdf Würth.