Labels Milestones
BackPentawattF-, MultiwattF-5 TO-220F-5 Horizontal RM 1.27mm staggered type-2 TO-220F-7, Vertical, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-2 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-220-4 Horizontal RM 2.54mm TO-220F-5, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 4.58mm IPAK TO-251-2, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220F-5 Vertical RM 2.54mm staggered type-2 TO-220F-4, Vertical, RM 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Horizontal RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 1.7mm, MultiwattF-11, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220-4 Vertical RM 5.45mm TO-3PB-3, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Horizontal RM 5.45mm TO-3PB-3, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220F-7 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220F-9, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils THT DIP DIL PDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size.
- 2.5/5-H-5.0-EX Terminal Block, 1991024 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1991024), generated with kicad-footprint-generator.
- 10nF | Film capacitor .