3
1
Back

0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YBG pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Quad Flat No-Lead Package, 3x3mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x33, 1.27mm pitch, 4.4mm socket length, double rows Surface mounted socket strip SMD 1x08 1.00mm single row style2 pin1 right Through hole pin header SMD 1x07 1.00mm single row Through hole horizontal IDC box header THT 2x07 1.00mm double row Through hole Samtec HPM power header series 11.94mm post length THT 1x09 2.54mm single row Through hole pin header SMD 1x32 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x13, 2.54mm pitch, single row Through hole angled pin header, 1x13, 2.00mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x31 2.00mm single row Surface mounted pin header THT 1x24 2.00mm single row Through hole straight pin header, 2x02, 2.00mm pitch, double rows Surface mounted socket strip THT 2x26 1.00mm double row surface-mounted straight socket strip, 1x27, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole.

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