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FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, NDQ, 5 pin (https://www.ti.com/lit/ml/mmsf022/mmsf022.pdf TO-PMOD-11 11-pin switching regulator package, http://www.ti.com/lit/ml/mmsf025/mmsf025.pdf Vishay PowerPAK SC70 single transistor package http://www.vishay.com/docs/70487/70487.pdf powerpak sc70 sc-70 dual Vishay PowerPAK SC70 single transistor package http://www.vishay.com/docs/70487/70487.pdf powerpak sc70 sc-70 dual Vishay PowerPAK SC70 dual transistor package http://www.vishay.com/docs/70486/70486.pdf TO-46-4 with Valox case, based on EPCOS app note 93 (https://www.catagle.com/45-2/PDF_AN93.htm Bourns TBU-CA Fuse, 2 Pin (https://www.bourns.com/data/global/pdfs/TBU-CA.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.15 mm² wire, reinforced insulation, conductor diameter 0.5mm, outer diameter 2mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2091, 9 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283), generated with kicad-footprint-generator JST XH series connector, 14110713010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with.

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