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BackFile Docs/build.md footprint "Perfboard_3x12" (version 20221018) (generator pcbnew footprint "SOCKET_2_PIN_Header" (version 20211014) (generator pcbnew All the remaining project files are covered by their original MIT license, with the distribution. THIS SOFTWARE IS PROVIDED BY THE.
- 1.5mm, 1 pads, pad diameter 3mm, see http://www.metz-connect.com/de/system/files/METZ_CONNECT_U_Contact_Katalog_Anschlusssysteme_fuer_Leiterplatten_DE_31_07_2017_OFF_024803.pdf?language=en.
- 1.6mm thick, 2-sided copper clad fiberglass. ENIG.