3
1
Back

- 8x8x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-14P-1.25DS, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py HVQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/msp430fr5720.pdf#page=108), generated with kicad-footprint-generator Soldered.

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