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Also compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (ST)-4.4 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing.

• Normal -1.304235e-001 2.235948e-001 9.659167e-001 facet normal -0.0989222 -0.0149092.
• 1.591057e+000 2.484855e+001 facet normal.
• 0.0820711 -0.0818897 0.993256 facet normal.

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