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1x38 1.00mm single row Through hole angled pin header SMD 1x30 2.00mm single row style2 pin1 right Through hole pin header THT 2x39 1.27mm double row surface-mounted straight socket strip, 2x27, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x18, 1.27mm pitch, 4.0mm pin length, single row Through hole pin header THT 2x27 1.27mm double row Through hole socket strip THT 1x11 1.27mm single row style1 pin1 left Surface mounted pin header THT 2x01 2.00mm double row Through hole straight pin header, 1x31, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x02, 1.27mm pitch, 4.0mm pin length, double rows Through hole IDC header, 2x15, 1.27mm pitch, 4.0mm pin length, double rows Through hole straight socket strip, 1x15, 1.27mm pitch, 3.9x4.9mm body, exposed pad, 4x4mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A Kintex-7 BGA, 30x30 grid, 31x31mm package.

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