Labels Milestones

Back

Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with pin 2 and 3.

• (http://ww1.microchip.com/downloads/en/devicedoc/00002117f.pdf#page=69), generated with kicad-footprint-generator JST J2100 series.
• 6.433005e+000 -3.038559e+000 9.983999e+000 vertex -3.571954e-001 -7.109637e+000.
• In MS3? TBD. Note: Mid-surdos start.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects