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Ord*sin(lf0), h0], [ ird*cos(lf1), ird*sin(lf1), h0], [ ord*cos(lf2), ord*sin(lf2), h0], [ ird*cos(lf0), ird*sin(lf0), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: merged pull request synth_mages/MK_VCO#4 merged pull request synth_mages/MK_SEQ#2 b77534e3fc Added schmancy pcb for v2 front panel and pcb into different files Add a printer_hole_scale.

Normal 5.212130e-13 -1.000000e+00 -1.578621e-14.
22x22 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78.
16369 -> 0 bytes.

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