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PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 506BU.PDF 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 32-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils SMD DIP DIL PDIP 2.54mm 26.669999999999998mm 1050mil SMDSocket LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 22-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 24-lead though-hole mounted.

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