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257 Ball, 19x19 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36.

• LongPads 6-lead though-hole mounted DIP package, row.
• MSTBVA_2,5/14-G; number of pins: 15; pin pitch: 3.50mm.
• Vertex 5.00497 5.09136 6.87866.
• 0.643699 0.553761 facet normal -0.353627 -0.43089.
• 6.79329 0.261859 7.03804 vertex 6.63876.

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