Labels Milestones
BackGrid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.605x2.703mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15.
- 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf.
- 43160-1106, With thermal vias in.
- Vertex 5.170141e+000 -2.984018e+000 2.488918e+001.
- -1.043771e+02 1.005852e+02 4.255000e+01 facet normal 0.083183.
- -5.35022 -5.0946 6.88312 facet normal -4.256463e-01.