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- 10x10x0.9 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [UDFN] (see Atmel-8815-SEEPROM-AT24CS01-02-Datasheet.pdf DFN, 8 Pin (https://datasheet.lcsc.com/lcsc/2204011730_GigaDevice-Semicon-Beijing-GD5F1GQ4UFYIGR_C2986324.pdf (page 44)), generated with kicad-footprint-generator Through hole angled pin header THT 2x10 1.00mm double row Through hole straight pin header, 1x37, 1.27mm pitch, single row Through hole straight socket strip, 2x32, 1.00mm pitch, single row Through hole angled socket strip, 1x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header THT 2x25 2.54mm double row Through hole straight socket strip, 1x26, 2.00mm pitch, double rows Surface mounted pin header SMD 1x21 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x09 1.27mm double row Through hole socket strip SMD 1x06 2.54mm single row style2 pin1 right Through hole Samtec HPM power header series 3.81mm post.

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