Labels Milestones
BackModule, column spacing 22.86 mm (900 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils.
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