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Raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header THT 1x24 1.27mm single row Through hole angled pin header, 2x06, 2.00mm pitch, double rows Through hole angled socket strip THT 1x29 1.00mm single row Through hole angled socket strip SMD 1x32 2.54mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x13, 2.00mm pitch, single row Surface mounted socket strip THT 2x03 2.00mm double row Through hole straight socket strip, 2x15, 1.27mm pitch, single row Surface mounted socket strip THT 2x21 2.54mm double row surface-mounted straight pin header, 2x30, 2.00mm pitch, 4.2mm pin length, double rows Through hole straight pin header, 2x29, 1.00mm.

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