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1x16, 2.00mm pitch, double rows Surface mounted pin header THT 1x38 1.00mm single row style2 pin1 right Through hole IDC header, 2x06, 1.00mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x23 2.00mm single row style2 pin1 right Through hole straight socket strip, 1x07, 1.27mm pitch, single row Surface mounted socket strip SMD 2x35 2.00mm double row Through hole pin header THT 1x29 1.27mm single row Through hole angled pin header, 2x19, 2.54mm pitch, single row Through hole straight pin header, 2x08, 1.00mm pitch, 2.0mm pin length, single row Through hole straight pin header, 1x31, 1.27mm pitch, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf.

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