synth_tools

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DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YBG pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition Appendix A Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin 2x2mm Pitch 0.5mm VSSOP DCU R-PDSO-G8 Pitch0.5mm VSSOP-8 3.0 x 2.0mm, orientation marker at cathode, https://dammedia.osram.info/media/resource/hires/osram-dam-25688470/SFH%202201%20A01_EN.pdf PhotoDiode, plastic DIL, 4.3x4.65mm², RM5.08 PhotoDiode plastic DIL RM5.08 PhotoTransistor, sidelooker package, RM2.54 PhotoTransistor sidelooker package RM2.54 package for Osram SFH9x0x series of reflective photo interrupters/couplers, see http://www.osram-os.com/Graphics/XPic6/00200860_0.pdf reflective photo interrupters/couplers, see http://www.osram-os.com/Graphics/XPic6/00200860_0.pdf reflective photo interrupters/couplers, see http://www.osram-os.com/Graphics/XPic6/00200860_0.pdf reflective photo interrupters/couplers, see http://www.osram-os.com/Graphics/XPic6/00200860_0.pdf reflective photo interrupters/couplers, see http://www.osram-os.com/Graphics/XPic6/00200860_0.pdf reflective photo interrupter coupler object detector Fiberoptic Reciver, RX, Toshiba, Toslink, TORX170, TORX173, TORX193, TORX194 Fiberoptic Reciver RX Toshiba Toslink TORX170 TORX173 TORX193 TORX194 IR Receiver Vishay TSOP-xxxx MOLD Oscillator, DIP8, Large Pads, http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf Oscillator, DIP14, Large Pads, http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf Oscillator, DIP14, Large Pads, http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf Oscillator, DIP14, Large Pads, http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf Miniature Crystal Clock Oscillator Abracon ASCO series, https://abracon.com/Oscillators/ASCO.pdf, 1.6x1.2mm^2 package SMD Crystal Oscillator Seiko Epson MC-156 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-156_en.pdf, 7.1x2.5mm^2 package SMD Crystal SERIES SMD2520/4 http://www.icbase.com/File/PDF/HKC/HKC00061008.pdf, 5.0x3.2mm^2 package 14-lead dip package, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils.

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