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SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Sxx-0.1.pdf dc-dc recom buck sip-12 pitch 2.54mm size 18.2x6.2mm^2 drill 1.1mm pad 2.1mm terminal block Metz Connect Type171_RT13705HBWC pitch 7.5mm size 54.8x14mm^2 drill 1.15mm pad 3mm Terminal Block 4Ucon ItemNo. 10697 vertical pitch 2.5mm size 17.2x10mm^2 drill 1.2mm pad 2.4mm Terminal Block Phoenix PTSM-0,5-4-2.5-H-THR pitch 2.5mm size 12.2x10mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix MKDS-3-14-5.08, 14 pins, pitch 5mm, size 10x12.6mm^2, drill diamater 1.3mm, pad.

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