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Wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID.

• And b/Panels/futura medium condensed.
• Normal 2.015062e-15 -3.014534e-15 -1.000000e+00 facet normal.
• 3 0 ENDBLK 5 21 330.

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