Labels Milestones
BackAccelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid.
- 1719341 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719341), generated with kicad-footprint-generator.
- -0.634912 0.0113542 vertex -4.13938 5.6469 10.3435.
- -0.55473 0.0546198 0.830236 facet.
- Strip, HLE-138-02-xxx-DV-LC, 38 Pins per row.
- 2.434567e+000 -5.153887e+000 1.747200e+001 facet normal.