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Coilcraft 1812CAN Series Common Mode Choke Coil SMD, Murata DLW5BTxxxSQ2x, https://www.murata.com/products/productdata/8796762701854/EFLC0020.pdf, manual footprint inductor common mode choke 1206 cnsw Inductor, Eaton, MCL2012V1, 2.0x1.2x0.9mm, https://eu.mouser.com/datasheet/2/87/eaton-mcl2012v1-multilayer-chip-inductor-data-shee-1622891.pdf Inductor ferrite multilayer power Ferrocore DLG-0302 unshielded SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5341 Microsemi Powermite 3 SMD power inductor, 3.0x2.8x2.5mm, https://www.tme.eu/Document/bda580f72a60a2225c2f6576c2740ae1/dlg-0504.pdf Ferrocore DLG-1004 unshielded SMD power inductor, CWR1242C, H=6.0mm (http://www.sagami-elec.co.jp/file/16Car_SMDCwr.pdf Sagami power inductor, CWR1242C, H=4.5mm (http://www.sagami-elec.co.jp/file/16Car_SMDCwr.pdf inductor sagami cwr12xx smd Sagami power inductor, 5.8x5.2x4.5mm, https://www.tme.eu/Document/bda580f72a60a2225c2f6576c2740ae1/dlg-0504.pdf Ferrocore DLG-1004 unshielded SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5341 Microsemi Powermite 3 SMD power inductor, 0808, 1.9x2.0mm, https://www.coilcraft.com/getmedia/50382b97-998f-4b75-b5ee-4a93b0ac4411/xfl2010.pdf Wire Wound Chip Common Mode Choke, https://www.coilcraft.com/pdfs/0805usb.pdf Coilcraft 1812CAN Series Common Mode Line Filter API Delevan, Surface Mount Bridge Rectifier Diode SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-150 , 20 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-133-02-xx-DV-PE-LC, 33 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ZE series connector, 504050-0791 (http://www.molex.com/pdm_docs/sd/5040500891_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-120-02-xxx-DV-LC, 20 Pins per row (http://www.molex.com/pdm_docs/sd/1053101208_sd.pdf), generated with kicad-footprint-generator Molex Pico-EZmate_Slim side entry JST VH PBT series connector, DF3EA-14P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing⟨=en&documentid=0001163317), generated with kicad-footprint-generator Molex Pico-SPOX Connector System, 5268-09A, 9 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator JST ZE series connector, 505405-0770 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0530, 5 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.1 mm² wires, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 52 Pin (https://www.nxp.com/docs/en/package-information/98ARL10526D.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py GPS Module, 15.5x15.5x6.3mm, https://www.u-blox.com/sites/default/files/SAM-M8Q_HardwareIntegrationManual_%28UBX-16018358%29.pdf GPS GNSS ublox ZED GSM NB-IoT module BC95 Quad-Band GSM/GPRS module, 17.6x15.7x2.3mm, http://simcom.ee/documents/SIM800C/SIM800C_Hardware_Design_V1.05.pdf Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf ublox Sara GSM/HSPA modem, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint for Mini-Circuits case CD542 (https://ww2.minicircuits.com/case_style/CD542.pdf) using land-pattern PL-052, including GND-vias (https://www.minicircuits.com/pcb/98-pl258.pdf Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf) using land-pattern PL-049, including GND-connections and vias (https://ww2.minicircuits.com/pcb/98-pl049.pdf Ai Thinker Ra-01 LoRa module wireless zigbee 802.15.4 thread nordic raytac nrf52840 nrf52833 Bluetooth Low Energy Module ble module st bluetooth Taiyo Yuden BK Series (see https://www.yuden.co.jp/productdata/catalog/mlci09_e.pdf Inductor, Walsin, WLFM201609x, 2.0x1.6x0.9mm, http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf Inductor, Walsin, WLFM252009x, 2.5x2.0x0.9mm, http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf Inductor, Walsin, WLFM201209x, 2.0x1.25x0.9mm, http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf Inductor, Wuerth, WE-XHMI 8080, 8.3mmx8.8mm (Script generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 105314-xx04, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex LY.

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