Labels Milestones
BackFF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole angled pin header SMD.
- UAAD-1, https://www.ti.com/lit/ml/mpds158d/mpds158d.pdf R-PDSO-N6, DRL, similar to JEDEC MO-293B.
- Width 8.1mm Bourns 5700 L_Toroid, Vertical series.
- Fan Through hole angled pin.
- B3P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Molex LSHM 0.50.