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Files (exported from Eeschema *.csv *.lck ########################## # Additional ignored # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Not plated through holes: ============================================================= From a22bca6d29ddc0a54597dab4d11ad9ab7e48e3c6 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Finish PCBs d74befe391233bd8b162f7f5705c277e04d9b135 Checkpoint after converting most things to SMD Checkpoint after re-centering sliders, before removing redundant LED resistors next to transistors to save on panel wires ttrss-plugin- _comics/init.php 511 lines label_font_size = 5; // Height of the knob spacing on the same "printed page" as the default. // Minimum size of 8 voltages controllable by individual knobs. MK's 5-step sequencer, expanded to 8 (or 10?) Bergman's 10-step sequencer (AKA Baby10 Outputs synchronized pitch and gate CV between 1 and 2 connected via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/MMM168.pdf, land pattern PL-247, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl052.pdf Footprint for Mini-Circuits case MMM168 (https://ww2.minicircuits.com/case_style/MMM168.pdf Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf) using land-pattern PL-049, including GND-connections and vias (https://ww2.minicircuits.com/pcb/98-pl049.pdf Ai Thinker Ra-01 LoRa module wireless zigbee 802.15.4 thread nordic raytac nrf52840 nrf52833 Bluetooth Low Energy Module ble module st bluetooth Taiyo Yuden BK Series (see https://www.yuden.co.jp/productdata/catalog/mlci09_e.pdf Inductor, Walsin, WLFM252009x, 2.5x2.0x0.9mm, http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf Inductor, Walsin, WLFM252009x, 2.5x2.0x0.9mm, http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf Inductor, Walsin, WLFM201209x, 2.0x1.25x0.9mm, http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf Inductor, Walsin, WLFM201209x, 2.0x1.25x0.9mm, http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf Inductor, Wuerth, WE-XHMI 8080, 8.3mmx8.8mm (Script generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 https://www.wolfspeed.com/media/downloads/87/CSD01060.pdf TO-252 / DPAK SMD package, http://rohmfs.rohm.com/en/techdata_basic/ic/package/hrp7_1-e.pdf, http://rohmfs.rohm.com/en/products/databook/datasheet/ic/motor/dc/bd621x-e.pdf SC-59, hand-soldering varaint, https://lib.chipdip.ru/images/import_diod/original/SOT-23_SC-59.jpg SOT, 3 Pin (https://www.jedec.org/system/files/docs/to-236h.pdf variant AB), generated with kicad-footprint-generator Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size.

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