Labels Milestones
BackDPDR, Pitch 3.2mm, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Specification+Or+Standard%7F108-98001%7FV%7Fpdf%7FEnglish%7FENG_SS_108-98001_V_IM_0614_v1.pdf%7F4-1462039-1 AXICOM IM-Series Relay SPDT Finder 40.11, https://www.finder-relais.net/de/finder-relais-serie-40.pdf Relay DPDT Form C AXICOM IM-Series Relay DPDT Schrack-RT2 RM5mm 16A 250V AC Form C AXICOM IM-Series Relay DPDR Pitch 5.08 IM Signal Relay DPDT Form C http://image.schrack.com/datenblaetter/h_rp810012-b.pdf Relay SPST Schrack-RT1 RM5mm 8A 250V AC Relay Finder 32.21-x000 Relay, SPDT, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Omron G5V-2 Relay DPDT Finder 40.41, Pitch 3.5mm/7.5mm, https://www.finder-relais.net/de/finder-relais-serie-40.pdf Relay DPDT IM-relay FRT5 Kemet signal relay, DPDT, non-latching, single coil latching, https://content.kemet.com/datasheets/KEM_R7002_EC2_EE2.pdf Kemet EC2 signal relay DPDT non single coil latching, https://content.kemet.com/datasheets/KEM_R7002_EC2_EE2.pdf Kemet EC2 signal relay DPDT double dual coil latching through hole M2, height 8, Wuerth electronics 9774070982 (https://katalog.we-online.de/em/datasheet/9774070982.pdf), generated with kicad-footprint-generator connector wire 0.75sqmm strain-relief Soldered wire connection with double feed through strain relief, for 3 times 2.5 mm² wire, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector wire 1.5sqmm double-strain-relief Soldered wire connection, for 5 times 1.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0530, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 3, Wuerth electronics 9774110960 (https://katalog.we-online.de/em/datasheet/9774110960.pdf,), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 24 Pin (JEDEC MO-194 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST GH series connector, S3P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M2, height 7, Wuerth electronics 9775106960 (https://katalog.we-online.com/em/datasheet/9775106960.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, B13B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0430, 4 Pins per.
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