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6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 506BU.PDF 8-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_8_05-08-1718.pdf DFN, 8 Pin (http://ww1.microchip.com/downloads/en/AppNotes/S72030.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.5 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend.

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