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BackHttps://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, off-center ball grid, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole socket strip SMD 1x09 1.27mm single row Through hole IDC header, 2x05, 2.54mm pitch, single row Surface mounted pin header SMD 2x05 2.54mm double row surface-mounted straight pin header, 1x11, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted pin header THT 1x34 1.27mm.
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