3
1
Back

Pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header, 2x06, 2.00mm pitch, single row Through hole angled pin header THT 1x39 2.00mm single row Through hole socket strip SMD 1x15 2.54mm single row Surface mounted.

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