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TSSOP10: plastic thin shrink small outline package; 16 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 14 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm.

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