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Https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YZR pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline Package (MS) [MSOP], variant of MSOP-16 (see https://www.analog.com/media/en/technical-documentation/data-sheets/3748fb.pdf MFSOP 4 pin SMD MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-8127-AVR-8-bit-Microcontroller-ATtiny4-ATtiny5-ATtiny9-ATtiny10_Datasheet.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA, 14 Pin (JEDEC MO-153 Var HB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FF0851SA1, 51 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ108178.pdf), generated with kicad-footprint-generator connector wire 2sqmm double-strain-relief Soldered wire connection with double feed through strain relief, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 2.1mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00045_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block TE 282834-9, 9 pins, pitch 7.5mm, size 75x10.3mm^2, drill diamater 1.2mm, pad diameter 2.6mm, see http://www.4uconnector.com/online/object/4udrawing/10699.pdf, script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type067_RT01903HDWC pitch 10mm size 12.3x14mm^2 drill 1.15mm pad 3mm Terminal Block Phoenix PT-1,5-13-5.0-H pitch 5mm size 15x9mm^2 drill 1.3mm pad 2.6mm Terminal Block TE 282834-4, 4 pins, pitch 5.08mm, hole diameter 1.0mm wire loop as test point, loop diameter 3.8mm, hole diameter 1.3mm, hole diameter 1.3mm, wire diameter 0.5mm test point THT pad as test Point, square 3.0mm side length, hole diameter 2.0mm test point plated hole Plated Hole as test point, loop diameter 3.8mm, hole diameter 2.0mm 2 pins LED_Rectangular Rectangular Rectangular size 5.0x5.0mm^2 2 pins diameter 3.0mm 2 pins diameter 5.0mm z-position of LED center 4.9mm 2 pins Rectangular size 3.0x2.0mm^2, 2 pins, diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 3.0mm 2 pins diameter 3.0mm z-position of LED center 3.0mm, 2 pins grey LED, diameter 5.0mm z-position of LED center 2.0mm 2 pins diameter 5.0mm THT rectangular pad as test Point, square 4.0mm side length SMD rectangular pad as test Point, square 1.0mm side length SMD rectangular pad as test Point, diameter 2.0mm THT pad as test Point, diameter 2.0mm wire loop as test Point, square 3.0mm side length SMD.

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