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Thru-hole 14 pin DIP socket A-001 1 14 pin DIP socket A-004 4 Knobs Screws, nuts, and spacers (see [build notes](build.md | | J2 | 1 | SW_3PDT_x3 | 3PDT miniature toggle switch | | S2 | 1 Fireball/Fireball.kicad_pcb | 2 ; DRILL file {KiCad 7.0.11-7.0.11~ubuntu22.04.1} date Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes count 0 Minor layout tweaks Based on a medium customarily used for a single 0.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py WLCSP-35, 2.168x2.998mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x24 2.00mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x32, 2.00mm pitch, 6.35mm socket length, single row Through hole socket strip SMD 1x36 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x10 2.54mm single row Surface mounted socket strip SMD 1x28 2.54mm single row Through hole straight socket strip, 2x49, 1.27mm pitch, double rows Surface mounted socket strip THT 1x27 1.27mm single row Through hole angled pin header THT 2x07 2.54mm double row surface-mounted straight socket strip, 2x15, 2.54mm pitch, 8.51mm socket length, double.

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