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Back

24 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 56 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf TSSOP, 8 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Hirose series connector, 53780-1570 (), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 44 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole straight pin header, 1x12, 1.00mm pitch, 2.0mm pin length, single row Through hole angled pin header SMD 1x13 2.00mm single row Surface mounted socket strip THT 2x21 2.00mm double row Through hole angled pin header SMD 1x20 2.54mm single row Through hole angled socket strip, 1x13, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x03 5.08mm single row Through hole straight socket strip, 1x07, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x13, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled socket.

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