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[QSOP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled pin header SMD 1x35 1.27mm single row Through hole socket strip THT 1x39 1.27mm single row Through hole socket strip THT 1x08 2.54mm single row style2 pin1 right Through hole straight socket strip, 1x34, 1.27mm pitch, 4.4mm socket length, single row Surface mounted pin header THT 1x23 1.00mm single row style2 pin1 right Through hole angled socket strip, 1x10, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight socket strip, 1x09, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header SMD 2x26 1.00mm double row Through hole vertical IDC header THT 1x13 2.54mm single row Through hole angled socket strip, 2x04, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x21, 2.54mm pitch, 6mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip, 2x28, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header SMD 1x14 1.00mm single row style2 pin1 right Through hole socket strip SMD 2x24 1.27mm double row Through hole angled pin header, 2x14, 2.54mm pitch.

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