synth_tools

Back

BMI-S-207-F Shielding Cabinet SMD 60x60mm WE-SHC Shielding Cabinet SMD 60x60mm WE-SHC Shielding Cabinet THT 61x61mm Signal Relay, 10x6mm, 2 Form C, vertical mount, 6A, 5-60V, https://www.fujitsu.com/sg/imagesgig5/ftr-ly.pdf relay SPST-NO form A relay Sanyou SRD series Form A http://www.alliedelec.com/m/d/543c6bed18bf23a83ae5238947033ee0.pdf Relay SPST Schrack-RT1 RM5mm 16A 250V AC Relay Relay SPST Schrack-RP3SL, 1-coil-version, RM5mm 16A 250V AC Relay Relay SPST Schrack-RT1 RM5mm 16A 250V AC Form C AXICOM IM-Series Relays, DPDR, Pitch 5.08 IM Signal Relay SPDT IM-relay HJR-4102 Omron Relay SPDT Finder 40.11 Relay DPDT Form C http://image.schrack.com/datenblaetter/h_rt114012--_de.pdf Relay SPST Schrack-RP3SL RM5mm 16A 250V AC Relay Relay SPST Schrack-RP-II/1 RM5mm 8A 250V AC Form A (NO), SPST http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Data+Sheet%7FPCH_series_relay_data_sheet_E%7F1215%7Fpdf%7FEnglish%7FENG_DS_PCH_series_relay_data_sheet_E_1215.pdf Relay socket DPDT Finder 96.12 56.32 package for Everlight ITR8307/F43, see https://everlighteurope.com/index.php?controller=attachment&id_attachment=5385 package for diode bridges, row spacing 9.53 mm (375 mils 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 6x-dip-switch SPST , Slide, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 2x-dip-switch SPST Omron_A6H-2101, Slide, row spacing 5.08 mm (200 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-Lead Plastic Stretched Small Outline (SS)-5.30 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96.

New Pull Request

Labels Milestones