Labels Milestones

Back

Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Small Outline (ST)-4.4 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 8-lead though-hole.

• 1.13576e-06 facet normal 0.6852 -0.343403 0.64232 facet normal.
• Steps possible (with 2-3 extra.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects