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(http://www.molex.com/pdm_docs/sd/5022501791_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a single 0.127 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0210, with PCB trace layout created pull request 'Put title box in PDF export Put title box in PDF export' (#4) from schematic by Eeschema.

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