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BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 Qorvo 2x2mm DFN package size 1006 3 pins LED, diameter 3.0mm 2 pins LED, Round, FlatTop, Rectangular size 5.0x2.0mm^2 z-position of LED center 2.0mm 2 pins LED, diameter 5.0mm z-position of LED center 1.6mm, 2 pins diameter 3.0mm z-position of LED center 3.0mm 3 pins diameter 3.0mm z-position of LED center 3.0mm 2 pins diameter 3.0mm Plated Hole as test point, pitch 6.35mm, hole diameter 1.0mm THT pad as test Point, diameter 2.0mm SMD pad as test Point, diameter 5.0mm z-position of LED center 3.0mm, 2 pins, diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 3.0mm, 2 pins, Rectangular size 5.0x2.0mm^2 3 pins LED, diameter 5.0mm, 3 pins, pitch 5mm, size 40x7.6mm^2, drill diamater 1.4mm, pad.

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