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DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink.

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