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All code is defined as all source code form or as a whole, provided Your use, reproduction, and distribution of derivative or collective works based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole horizontal IDC header THT 2x10 1.27mm double row Through hole angled pin header SMD 2x20 1.00mm double row Through hole angled socket strip, 2x38, 2.54mm pitch, single row Through hole pin header THT 1x31 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x32, 1.27mm pitch, 4.0mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole Samtec HPM power header series 3.81mm post length, 1x05, 5.08mm pitch, see http://www.vishay.com/docs/88609/gbl005.pdf Vishay GBL rectifier package, 5.08mm pitch, single row Through hole straight pin header, 1x14, 2.00mm pitch, single row male, vertical entry, strain relief clip Harwin LTek Connector, 34 pins, dual row male, vertical entry, no latches, PN:G125-MVX0605L0X Harwin Gecko Connector, 12 pins, dual row male, vertical entry, strain relief clip Harwin LTek Connector, 44 pins, through hole 2.7mm, height 6.5, Wuerth electronics 9775036360 (https://katalog.we-online.com/em/datasheet/9775036360.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WQFN, 14 Pin (https://www.st.com/resource/en/datasheet/lsm6ds3tr-c.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x9.18mm 3x-dip-switch SPST , Piano, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD.

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