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Https://www.neutrik.com/en/product/nc3fah1-da A Series, 3 pole female receptacle, grounding: mating connector shell and front panel, vertical PCB mount, https://www.neutrik.com/en/product/nc5mah A Series, 3 pole male XLR receptacle, grounding: separate ground contact to mating connector shell and front panel, horizontal PCB mount, retention spring instead of latch, https://www.neutrik.com/en/product/nc3fah-0 A Series, 5 pole female XLR receptacle, grounding: mating connector shell and front panel, lateral left PCB mount, black chrome shell, https://www.neutrik.com/en/product/nc5mbh-b B Series, 3 pole female XLR receptacle, grounding: separate ground contact to mating connector shell to pin1 and front panel, horizontal PCB mount, https://www.neutrik.com/en/product/nc5mah A Series, 3 pole male XLR receptacle, grounding: without ground/shell contact, vertical PCB mount, asymmetric push, https://www.neutrik.com/en/product/nc3fbh1-da B Series, 3 pole male XLR receptacle, grounding: separate ground contact connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf 56-Lead Plastic Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (MR) - 9x9x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CN (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [QFN]; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x13, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x28, 1.27mm pitch, single row Surface mounted socket strip SMD 1x21 1.27mm single row style2 pin1 right Through hole pin header SMD 1x40 2.54mm single row Surface mounted pin header THT 2x19 1.27mm double row surface-mounted straight pin header, 2x08, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole angled socket strip, 1x21, 2.54mm pitch, single row Through hole angled socket strip, 2x02, 2.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight Samtec HPM.

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