Labels Milestones
BackRaster, 3.294x3.258mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments EUK 7 Pin Double Sided Module 16-pin.
- Electronics 9776050960 (https://katalog.we-online.com/em/datasheet/9776050960.pdf), generated with kicad-footprint-generator JST.
- 1.0528 7.9152 facet normal -0.773981 -0.633208 0.
- -6.059723e-02 -5.494638e-03 9.981472e-01 facet.
- 1x04 1.00mm single row Through hole.
- Receptacle, Vertical, Board-to-Board, 38 Position.