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Connectivity, HDI, Wire-to-Board, Fully Shrouded, Header: https://www.te.com/usa-en/product-440055-2.datasheet.pdf connector header hdr horizontal right-angle shrouded fully-shrounded 440054-2 2-440054-2 4-440054-2 6-440054-2 2-440054-6 4-440054-6 6-440054-6 TE Connectivity, HDI, Wire-to-Board, Fully Shrouded, Vertical Header: https://www.te.com/usa-en/product-440054-2.datasheet.pdf connector header hdr horizontal vertical shrouded fully-shrounded 440055-2 2-440055-2 4-440055-2 6-440055-2 8-440055-2 TE Connectivity Buchanan WireMate connector, Poke-In series, 4-way, 4.0mm pitch, AWG18-22 (0.3255-0.823mm2), https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F2834006%7FB6%7Fpdf%7FEnglish%7FENG_CD_2834006_B6.pdf%7F2834006-1 TE Connectivity Buchanan WireMate connector, Poke-In series, 1-way, 4.0mm pitch, AWG18-22 (0.3255-0.823mm2), https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F2834006%7FB6%7Fpdf%7FEnglish%7FENG_CD_2834006_B6.pdf%7F2834006-1 TE-Connectivity Micro-MaTch Vertical 2-215079-0 9-215079-20 TE-Connectivity Micro-MaTch Vertical 215079-6 7-215079-6 TE-Connectivity Micro-MaTch Vertical 1-215079-8 8-215079-18 TE-Connectivity Micro-MaTch female-on-board top-entry thru-hole 16 pin with exposed pad 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf), generated with kicad-footprint-generator JST GH series connector, SM10B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T3255-9)), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 28 Pin (http://www.ti.com/lit/ds/symlink/tps51363.pdf#page=29), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-104-02-xx-DV-TE, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator connector Wuerth WR-WTB series connector, 502386-0670 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator connector TE MATE-N-LOK top entry connector harwin ltek M80 Harwin LTek Connector, 8 pins, pitch 5mm, size 25x7.6mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block 4Ucon ItemNo. 10704 vertical pitch 3.5mm size 28x7.6mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix MKDS-3-15-5.08 pitch 5.08mm length 9mm diameter 8mm Electrolytic Capacitor CP, Radial series, Radial, pin pitch=5.00mm, , diameter*width=7.5*4.4mm^2, Capacitor C Radial series Radial pin pitch 7.50mm length 10mm width 4mm Capacitor C, Disc series, Radial, pin pitch=7.50mm, , length*width=9*9.5mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series Radial pin pitch 22.50mm length 26.5mm width 7mm Capacitor C, Disc series, Radial, pin pitch=10.00mm, , length*width=11.5*9.8mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series Radial pin pitch 5.08mm length 11mm diameter 4.5mm Tantal Electrolytic Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/TANTAL-TB-Serie%23.pdf CP Radial_Tantal series Radial pin pitch 45mm length 42mm diameter 23.0mm Electrolytic Capacitor C, Rect series, Radial, pin pitch=2.50mm, , diameter*width=3.8*2.6mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf C Disc series Radial pin pitch 5.00mm diameter 12.5mm width 5.0mm Capacitor C, Rect series, Radial, pin pitch=18.29mm, , diameter=27.9mm, Vishay, IHB-3, http://www.vishay.com/docs/34015/ihb.pdf.

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