Labels Milestones
Back10706 vertical pitch 5mm size 60x8.1mm^2 drill 1.1mm pad 2.1mm terminal block Metz Connect Type175_RT02706HBLC, 6 pins, pitch 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge OnSemi SDIP-4L, see https://www.onsemi.com/pdf/datasheet/df10s1-d.pdf OnSemi Diode Bridge SDIP-4L SMD diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://www.analog.com.tw/pdf/All_In_One.pdf TSOT, 5 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x40 2.00mm double row surface-mounted straight pin header, 2x20, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x18 1.27mm single row Through hole pin header.
- BT:style=Medium"; STLs, 10hp version, others.
- Ceramic may work, test debouncing. Maybe enlarge footprint.
- - ~27K to U3-8? No, transistors maybe.