Labels Milestones
BackTricolor PLCC-4 LED, https://docs.broadcom.com/docs/ASMB-KTF0-0A306-DS100 LED Avago PLCC-6 ASMT-YTB7-0AA02 High Power CSP LED, 2.36mm x 2.36mm, 1.4A max, https://cdn.samsung.com/led/file/resource/2021/01/Data_Sheet_LH181B_Rev.4.0.pdf 2.0mm x 2.0mm Addressable RGB LED NeoPixel addressable Kingbright, dual LED, 3.5 x 2.8 mm Surface Mount Double Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89018xx, 18 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator Molex LSHM 0.50 mm Razor Beam High-Speed Hermaphroditic Terminal/Socket Strip, LSHM-140-xx.x-x-DV-S, 40 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 32 Pin (JEDEC MO-241/VAA, https://assets.nexperia.com/documents/package-information/SOT762-1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flat, No Lead Package - 10x10x0.9 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16 Pin (JEDEC MO-153 Var GC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-6010, 60 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated.
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