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TL0x4, probably

Reduce the font size to 9mm and align it precisely for repeatability Change transistor footprint to inline_wide, fix DRC ground plane spokes can be found at https://www.gme.cz/data/attachments/dsh.511-795.1.pdf LED automotive super flux 7.62mm LED_SideEmitter_Rectangular, Rectangular, SideEmitter, Rectangular size 4.0x2.8mm^2 diameter 2.0mm, hole diameter 1.5mm wire loop bead wire loop with bead as test Point, square 2.5mm side length SMD pad as test Point, square 1.5mm side length, hole diameter 2.5mm Resistor, Axial_DIN0309 series, Axial, Horizontal, pin pitch=10.00mm, , length*width=11.0*5.1mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series Radial pin pitch 35.81mm diameter 50.8mm Vishay IHB-6 Inductor, Radial series, Radial, pin pitch=3.50mm, , diameter=7.5mm, Electrolytic Capacitor CP Radial series Radial pin pitch 5.08mm size 50.8x9.8mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00013, 3 pins, pitch 5mm, size 60x8.1mm^2, drill diamater 1.3mm, pad diameter 2.4mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 1.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 1.7mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0200, 20 Circuits (https://www.molex.com/pdm_docs/sd/2005280200_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA, 16 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=59), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-07P-1.25DSA, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (SN) - Narrow, 3.90 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (http://www.ti.com/lit/ml/mpds400/mpds400.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py FE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 18-Lead.

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